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Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC TR-460A

  • Trouble Shooting Checklist for Wave Soldering of Printed Wiring Boards

  • 【Date】1984/2/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.2.13.1A

  • Thickness, Plating in Holes Micro-Ohms Method

  • 【Date】1983/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.3.8A

  • Flammability, Flexible Insulating Materials

  • 【Date】1982/12/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.1.5A

  • Surface Examination, Unclad and Metal Clad Material

  • 【Date】1982/12/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-422

  • Design Guide for Press Fit Rigid Printed Board Backplanes

  • 【Date】1982/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-422 CD

  • Design Guide for Press Fit Rigid Printed Board Backplanes

  • 【Date】1982/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.3.30A

  • Solvent pH Determination in Anhydrous Fluorocarbon Solvents

  • 【Date】1981/11/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TR-481

  • Results of Multilayer Test Program Round Robin V

  • 【Date】1981/4/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.18B

  • Tensile Strength and Elongation, Copper Foil

  • 【Date】1980/8/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TR-468

  • Factors Affecting Insulation Resistance Performance of Printed Boards

  • 【Date】1979/3/1
  • 【Language】English
  • 【Status】Active