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- 【Organization】IEC
- 【Document #】IEC 60966-4-1
Radio frequency and coaxial cable assemblies Part 4-1: Blank detail specification for semi-rigid coaxial cable assemblies - Edition 2.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC TR 62188
Secondary cells and batteries containing alkaline or other non-acid electrolytes Design and manufacturing recommendations for portable batteries made from sealed secondary cells - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-14
Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity) - Edition 1.0; Together with IEC 60749-31:2002, IEC 60749-3:2002 And IEC 60749-15:2003 Replaces IEC 60749:2002
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-1 CORR 1
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 1: General CORRIGENDUM 1 - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-10 CORR 1
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-11 CORR 2
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 2 - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-2 CORR 1
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 2: Low Air Pressure CORRIGENDUM 1 - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-22 CORR 1
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 22: Bond strength CORRIGENDUM 1 - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-31 CORR 1
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 31: Flammability of plastic-encapsulated devices (internally induced) CORRIGENDUM 1 - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active
- 【Organization】IEC
- 【Document #】IEC 60749-8 CORR 2
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 8: Sealing CORRIGENDUM 2 - Edition 1.0
- 【Date】2003/8/1
- 【Language】English; French
- 【Status】Active