IPC
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- 【Organization】IPC
- 【Document #】IPC 2226A
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
- 【Date】2017/9/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.53
Dye and Pull Test Method (Formerly Known as Dye and Pry)
- 【Date】2017/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4552A
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
- 【Date】2017/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC A-640
Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
- 【Date】2017/7/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 7091
Design and Assembly Process Implementation of 3D Components
- 【Date】2017/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4921A
Requirements for Printed Electronics Base Materials (Substrates)
- 【Date】2017/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 1401
Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry
- 【Date】2017/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 1401 CHINESE
Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry
- 【Date】2017/3/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 7530A
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
- 【Date】2017/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4101E
Specification for Base Materials for Rigid and Multilayer Printed Boards
- 【Date】2017/3/1
- 【Language】English
- 【Status】Active