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Organization / Document #
IPC
Search Result: About 1073 results.

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  • 【Organization】IPC
  • 【Document #】IPC D-355

  • Printed Board Assembly Description in Digital Form

  • 【Date】1995/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-355 CD

  • Printed Board Assembly Description in Digital Form

  • 【Date】1995/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC J-STD-005 CHINESE CD

  • Requirements for Soldering Pastes - Incorporates Amendment 1: June 1996

  • 【Date】1995/1/1
  • 【Language】Chinese
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC J-STD-005 JAPANESE

  • Requirements for Soldering Pastes - Incorporates Amendment 1: June 1996

  • 【Date】1995/1/1
  • 【Language】Japanese
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC J-STD-005 JAPANESE CD

  • Requirements for Soldering Pastes - Incorporates Amendment 1: June 1996

  • 【Date】1995/1/1
  • 【Language】Japanese
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.51

  • Self Shimming Thermally Conductive Adhesives

  • 【Date】1995/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.35

  • Solder Paste - Slump Test

  • 【Date】1995/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.43

  • Solder Paste - Solder Ball Test

  • 【Date】1995/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.44

  • Solder Paste - Tack Test

  • 【Date】1995/1/1
  • 【Reaffirmed Date】(R 1998)
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.45

  • Solder Paste - Wetting Test

  • 【Date】1995/1/1
  • 【Language】English
  • 【Status】Active