Breadcrumb
- Home
- Magazine
- High Tech., Communication
- Magazine
Components and Packaging Technologies, IEEE Transactions on
Frequency:4
Language:English
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.
For more information, please contact
Hinton Information Services
TEL:+886 2 27993110 ext. 216
FAX:+886 2 27995560
mag@hintoninfo.com