FLIP CHIP/WLP MANUFACTURING AND MARKET ANALYSIS
出 版 商：The Information Network
出版日期：2016/10/01
價 格：
USD 2,495 (Single-User License)
Chapter 1 Introduction 1-1
Chapter 2 Executive Summary 2-1
Chapter 3 Flip Chip/WLP Issues and Trends 3-1
3.1 Introduction 3-1
3.2 Wafer Bumping 3-6
3.2.1 Solder Bumps 3-7
3.2.1.1 Metallurgy 3-7
3.2.1.2 Deposition Of UBM 3-11
3.2.1.3 Sputter Etching 3-12
3.2.1.4 Photolithography 3-13
3.2.1.5 Solder Deposition 3-14
3.2.1.6 Resist Strip 3-15
3.2.1.7 UBM Wet Etch 3-16
3.2.1.8 Reflow 3-16
3.2.1.9 Flux Issues 3-18
3.2.2 Gold Bumps 3-19
3.2.2.1 Bump Processing 3-19
3.2.2.2 Bonding 3-21
3.2.2.3 Coplanarity 3-25
3.2.2.4 Conductivity 3-26
3.2.2.5 Thermal Properties 3-26
3.2.2.6 Size 3-27
3.2.2.7 Reliability 3-27
3.2.2.8 Cost Issues 3-28
3.2.3 Copper Pillar Bumps 3-31
3.2.4 Copper Stud Bumping 3-35
3.2.5 C4NP 3-40
3.3 Wafer Level Packaging 3-46
3.4 Pad Redistribution 3-53
3.5 Wafer Bumping Costs 3-57
3.5.1 Wafer Redistribution And Wafer Bumping Costs 3-58
3.5.2 WLCSP Hidden Costs 3-59
3.5.3 WLCSP Cost Per Good Die 3-60
3.5.4 Wafer-Level Underfill Costs 3-61
Chapter 4 Lithography Issues And Trends 4-1
4.1 Issues
4-1
4.1.1 Technical Performance 4-2
4.1.2 Capital Investment 4-2
4.1.3 Cost Of Consumables 4-2
4.1.4 Throughput 4-2
4.1.5 Ease Of Use 4-3
4.1.6 Flexibility 4-3
4.1.7 Equipment Support 4-3
4.1.8 Resolution 4-3
4.1.9 Solder Bumping Capabilities 4-4
4.1.10 Gold Bumping Capabilities 4-5
4.2 Exposure Systems 4-6
4.2.1 Introduction 4-6
4.2.1.1 Reduction Steppers 4.6
4.2.1.2 Full-Field Projection 4-8
4.2.1.3 Mask Aligners 4-13
4.2.1.4 1X Steppers 4-13
4.3 Competitive Technologies 4-16
4.3.1 Inkjet Printing 4-16
4.3.2 Stencil/Screen Printing 4-18
4.3.3 Electroless Metal Deposition 4-22
Chapter 5 UBM Etch Issues And Trends 5-1
5.1 Introduction 5-1
5.2 Technology Issues And Trends 5-2
5.2.1 Process Flow 5-2
5.2.2 Etch Process 5-4
5.2.3 Etch Chemistry 5-8
5.3 Batch Versus Single-Wafer Etching 5-16
Chapter 6 Metallization Issues and Trends 6-1
6.1 Introduction 6-1
6.2 Sputtering Metallization 6-3
6.2.1 Gold Bump 6-3
6.2.2 Solder Bumping 6-4
6.2.2.1 T i / Cu and TiW / Cu 6-5
6.2.2.2 Al / NiV / Cu 6-5
6.2.2.3 T i / N i (V) and TiW / Ni ( V ) 6-6
6.2.2.4 Cr / Cr-Cu / Cu 6-6
Chapter 7 Market Analysis 7-1
7.1 Market Drivers For Flip Chip And WLP 7-1
7.1.1 WLP For Small Die 7-2
7.1.2 WLP For Medium Die 7-2
7.1.3 WLP For Large Die 7-3
7.2 Market Opportunities 7-5
7.3 Challenges 7-9
7.4 Flip Chip Market 7-12
7.4.1 Market Dynamics 7-12
7.4.2 Market Forecast 7-20
7.5 Lithography Market 7-26
7.5.1 Aligners Vs. Steppers 7-26
7.5.2 Market Analysis 7-27
7.6 Wet Etch Market 7-32
7.7 Deposition Market 7-37
List of Tables
3.1 Common UBM Stacks For Solder And Gold Bumping 3-8
3.2 Solder Bumping Guidelines 2-10
3.3 Gold Bumping Guidelines 3-24
3.4 Copper Bumping Guidelines 3-34
3.5 Comparison Of Solder Bumping Processes 3-43
4.1 Key Challenges For WLP Lithography 4-12
4.2 Lithography Tools By Vendor 4-15
5.1 UBM Film Etchants 5-10
5.2 Advantages Of Spin Processing 5-19
6.1 Common UBM Stacks For Gold And Solder Bumping 6-2
7.1 WLP Demand by Device (Units) 7-24
7.2 WLP Demand by Device (Wafers) 7-25
7.3 Comparison Of Mask Aligners Versus Steppers 7-28
7.4 Worldwide Lithography Forecast 7-29
7.5 Worldwide Forecast For UBM Etch Tools 7-34
7.6 Worldwide Forecast For UBM Etchants 7-36
7.7 Worldwide Forecast For Deposition Tools 7-38
List of Figures
3.1 C4 Chip Connections 3-3
3.2 Wafer Bump Technology Roadmap 3-4
3.3 Comparison Of Copper Pillar, Flip Chip, And WLP 3-5
3.4 Solder Bumping Process 3-9
3.5 Three Process Flows For Solder Bumping 3-17
3.6 Gold Bumping Process 3-23
3.7 Cost Per Gold Bumped Wafer 3-29
3.8 Copper Stud Bump 3-36
3.9 Breakdown Of Stud Bumping Costs 3-39
3.10 C4NP Process Description 3-41
3.11 Pillar-WLPCSP Process 3-51
3.12 Pad Redistribution Process 3-54
4.1 Laser-Projection Imaging 4-10
4.2 Solder Jet Technology 4-17
4.3 Principle Of Screen Printing 4-20
4.4 Principle Of Inkjet Printing 4-21
4.5 Electroless Under Bump Metallization 4-23
5.1 Electroplated Solder Bumping Process 5-3
7.1 WLP Applications By Die Size 7-4
7.2 WLP Applications 7-6
7.3 Flip Chip Market - 2012 7-21
7.4 Flip Chip Market - 2017 7-22
7.5 Historic Lithography Market Shares 7-30
7.6 Lithography Market Shares 7-31
7.7 Wet Etch Market Shares 7-35
Chapter 2 Executive Summary 2-1
Chapter 3 Flip Chip/WLP Issues and Trends 3-1
3.1 Introduction 3-1
3.2 Wafer Bumping 3-6
3.2.1 Solder Bumps 3-7
3.2.1.1 Metallurgy 3-7
3.2.1.2 Deposition Of UBM 3-11
3.2.1.3 Sputter Etching 3-12
3.2.1.4 Photolithography 3-13
3.2.1.5 Solder Deposition 3-14
3.2.1.6 Resist Strip 3-15
3.2.1.7 UBM Wet Etch 3-16
3.2.1.8 Reflow 3-16
3.2.1.9 Flux Issues 3-18
3.2.2 Gold Bumps 3-19
3.2.2.1 Bump Processing 3-19
3.2.2.2 Bonding 3-21
3.2.2.3 Coplanarity 3-25
3.2.2.4 Conductivity 3-26
3.2.2.5 Thermal Properties 3-26
3.2.2.6 Size 3-27
3.2.2.7 Reliability 3-27
3.2.2.8 Cost Issues 3-28
3.2.3 Copper Pillar Bumps 3-31
3.2.4 Copper Stud Bumping 3-35
3.2.5 C4NP 3-40
3.3 Wafer Level Packaging 3-46
3.4 Pad Redistribution 3-53
3.5 Wafer Bumping Costs 3-57
3.5.1 Wafer Redistribution And Wafer Bumping Costs 3-58
3.5.2 WLCSP Hidden Costs 3-59
3.5.3 WLCSP Cost Per Good Die 3-60
3.5.4 Wafer-Level Underfill Costs 3-61
Chapter 4 Lithography Issues And Trends 4-1
4.1 Issues
4-1
4.1.1 Technical Performance 4-2
4.1.2 Capital Investment 4-2
4.1.3 Cost Of Consumables 4-2
4.1.4 Throughput 4-2
4.1.5 Ease Of Use 4-3
4.1.6 Flexibility 4-3
4.1.7 Equipment Support 4-3
4.1.8 Resolution 4-3
4.1.9 Solder Bumping Capabilities 4-4
4.1.10 Gold Bumping Capabilities 4-5
4.2 Exposure Systems 4-6
4.2.1 Introduction 4-6
4.2.1.1 Reduction Steppers 4.6
4.2.1.2 Full-Field Projection 4-8
4.2.1.3 Mask Aligners 4-13
4.2.1.4 1X Steppers 4-13
4.3 Competitive Technologies 4-16
4.3.1 Inkjet Printing 4-16
4.3.2 Stencil/Screen Printing 4-18
4.3.3 Electroless Metal Deposition 4-22
Chapter 5 UBM Etch Issues And Trends 5-1
5.1 Introduction 5-1
5.2 Technology Issues And Trends 5-2
5.2.1 Process Flow 5-2
5.2.2 Etch Process 5-4
5.2.3 Etch Chemistry 5-8
5.3 Batch Versus Single-Wafer Etching 5-16
Chapter 6 Metallization Issues and Trends 6-1
6.1 Introduction 6-1
6.2 Sputtering Metallization 6-3
6.2.1 Gold Bump 6-3
6.2.2 Solder Bumping 6-4
6.2.2.1 T i / Cu and TiW / Cu 6-5
6.2.2.2 Al / NiV / Cu 6-5
6.2.2.3 T i / N i (V) and TiW / Ni ( V ) 6-6
6.2.2.4 Cr / Cr-Cu / Cu 6-6
Chapter 7 Market Analysis 7-1
7.1 Market Drivers For Flip Chip And WLP 7-1
7.1.1 WLP For Small Die 7-2
7.1.2 WLP For Medium Die 7-2
7.1.3 WLP For Large Die 7-3
7.2 Market Opportunities 7-5
7.3 Challenges 7-9
7.4 Flip Chip Market 7-12
7.4.1 Market Dynamics 7-12
7.4.2 Market Forecast 7-20
7.5 Lithography Market 7-26
7.5.1 Aligners Vs. Steppers 7-26
7.5.2 Market Analysis 7-27
7.6 Wet Etch Market 7-32
7.7 Deposition Market 7-37
List of Tables
3.1 Common UBM Stacks For Solder And Gold Bumping 3-8
3.2 Solder Bumping Guidelines 2-10
3.3 Gold Bumping Guidelines 3-24
3.4 Copper Bumping Guidelines 3-34
3.5 Comparison Of Solder Bumping Processes 3-43
4.1 Key Challenges For WLP Lithography 4-12
4.2 Lithography Tools By Vendor 4-15
5.1 UBM Film Etchants 5-10
5.2 Advantages Of Spin Processing 5-19
6.1 Common UBM Stacks For Gold And Solder Bumping 6-2
7.1 WLP Demand by Device (Units) 7-24
7.2 WLP Demand by Device (Wafers) 7-25
7.3 Comparison Of Mask Aligners Versus Steppers 7-28
7.4 Worldwide Lithography Forecast 7-29
7.5 Worldwide Forecast For UBM Etch Tools 7-34
7.6 Worldwide Forecast For UBM Etchants 7-36
7.7 Worldwide Forecast For Deposition Tools 7-38
List of Figures
3.1 C4 Chip Connections 3-3
3.2 Wafer Bump Technology Roadmap 3-4
3.3 Comparison Of Copper Pillar, Flip Chip, And WLP 3-5
3.4 Solder Bumping Process 3-9
3.5 Three Process Flows For Solder Bumping 3-17
3.6 Gold Bumping Process 3-23
3.7 Cost Per Gold Bumped Wafer 3-29
3.8 Copper Stud Bump 3-36
3.9 Breakdown Of Stud Bumping Costs 3-39
3.10 C4NP Process Description 3-41
3.11 Pillar-WLPCSP Process 3-51
3.12 Pad Redistribution Process 3-54
4.1 Laser-Projection Imaging 4-10
4.2 Solder Jet Technology 4-17
4.3 Principle Of Screen Printing 4-20
4.4 Principle Of Inkjet Printing 4-21
4.5 Electroless Under Bump Metallization 4-23
5.1 Electroplated Solder Bumping Process 5-3
7.1 WLP Applications By Die Size 7-4
7.2 WLP Applications 7-6
7.3 Flip Chip Market - 2012 7-21
7.4 Flip Chip Market - 2017 7-22
7.5 Historic Lithography Market Shares 7-30
7.6 Lithography Market Shares 7-31
7.7 Wet Etch Market Shares 7-35
