2016 Comparison of Application Processor Packaging
出 版 商:Yole Developpement
出版日期:2017/01/01
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package