Fan-Out Wafer Level Packaging Patent Landscape Analysis
出 版 商：Yole Developpement
出版日期：2016/11/01
價 格：
EUR 5,990 (Global-User License)
With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position.
