TSMC Integrated Fan-Out (inFO) Package in Apple’s A10 Application Processor
出 版 商：Yole Developpement
出版日期：2016/10/01
價 格：
EUR 3,490 (Global-User License)
Reverse engineering and costing of the new inFO packaging technology from TSMC used for Apple’s latest A10 application processor, found in the iPhone 7 and 7 Plus
