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- 【Organization】IPC
- 【Document #】IPC 2152 GERMAN
Standard for Determining Current Carrying Capacity in Printed Board Design
- 【Date】2009/8/1
- 【Language】German
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2152 GERMAN CD
Standard for Determining Current Carrying Capacity in Printed Board Design
- 【Date】2009/8/1
- 【Language】German
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4553A
Specification for Immersion Silver Plating for Printed Boards
- 【Date】2009/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4553A CD
Specification for Immersion Silver Plating for Printed Boards
- 【Date】2009/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4553A CHINESE
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
- 【Date】2009/5/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.27
Thermal Stress, Convection Reflow Assembly Simulation
- 【Date】2009/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.5.11
Propagation Delay of Lines on Printed Boards by TDR
- 【Date】2009/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC WP-009
A Summary of Tin Whisker Research References
- 【Date】2009/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TR-586
Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
- 【Date】2009/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC-9703
Mechanical Shock Test Guidelines for Solder Joint Reliability
- 【Date】2009/3/1
- 【Language】English
- 【Status】Active