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- 【Organization】IPC
- 【Document #】IPC J-STD-004B CD
Requirements for Soldering Fluxes - Incorporates Amendment 1: November 2011; CD Rom
- 【Date】2008/12/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 9252A CD
Requirements for Electrical Testing of Unpopulated Printed Boards
- 【Date】2008/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 9252A CHINESE
Requirements for Electrical Testing of Unpopulated Printed Boards
- 【Date】2008/11/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 9252A CHINESE CD
Requirements for Electrical Testing of Unpopulated Printed Boards - On CD-ROM
- 【Date】2008/11/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC CC-830B CD
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
- 【Date】2008/10/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC CC-830B AMD 1
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
- 【Date】2008/9/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-075 GERMAN
Classification of Non-IC Electronic Components for Assembly Processes
- 【Date】2008/8/1
- 【Language】German
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-075
Classification of Non-IC Electronic Components for Assembly Processes
- 【Date】2008/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-075 CHINESE
Classification of Non-IC Electronic Components for Assembly Processes
- 【Date】2008/8/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-075 SPANISH
Classification of Non-IC Electronic Components for Assembly Processes
- 【Date】2008/8/1
- 【Language】Spanish
- 【Status】Active