IPC
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- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-033B.1 ITALIAN
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007
- 【Date】2005/10/1
- 【Language】Italian
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-030 CD
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
- 【Date】2005/9/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.5.10
High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials
- 【Date】2005/7/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC A-610D FINNISH
Acceptability of Electronic Assemblies
- 【Date】2005/2/1
- 【Language】Finnish
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC A-610D FINNISH CD
Acceptability of Electronic Assemblies
- 【Date】2005/2/1
- 【Language】Finnish
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC A-610D JAPANESE
Acceptability of Electronic Assemblies
- 【Date】2005/2/1
- 【Language】Japanese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC A-610D RUSSIAN CD
Acceptability of Electronic Assemblies
- 【Date】2005/2/1
- 【Language】Russian
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-001D ITALIAN CD
Requirements for Soldered Electrical and Electronic Assemblies
- 【Date】2005/2/1
- 【Language】Italian
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-001D JAPANESE CD
Requirements for Soldered Electrical and Electronic Assemblies
- 【Date】2005/2/1
- 【Language】Japanese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-001D ROMANIAN
Requirements for Soldered Electrical and Electronic Assemblies
- 【Date】2005/2/1
- 【Language】Romanian
- 【Status】Active