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- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.14.2A
Liquid Flux Activity, Wetting Balance Method
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC-9702 CD
Monotonic Bend Characterization of Board-Level Interconnects
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC-9702 CHINESE
Monotonic Bend Characterization of Board-Level Interconnects
- 【Date】2004/6/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC-9702 CHINESE CD
Monotonic Bend Characterization of Board-Level Interconnects
- 【Date】2004/6/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC-9702
Monotonic Bend Characterization of Board-Level Interconnects - with Amendment 1: May 2015
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3.33D
Presence of Halides in Flux, Silver Chromate Method
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3.34C
Solids Content, Flux
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.46A
Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.3.3B
Surface Insulation Resistance, Fluxes
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.1
Visual Test Methods - Revision K
- 【Date】2004/6/1
- 【Language】English
- 【Status】Active