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Organization / Document #
IPC
Search Result: About 1073 results.

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  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.18.1A

  • Tensile Strength and Elongation, In-House Plating

  • 【Date】2004/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.6.7.2B

  • Thermal Shock, Continuity and Microsection, Printed Board

  • 【Date】2004/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.6.8E

  • Thermal Stress, Plated-Through Holes

  • 【Date】2004/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.6.9B

  • Vibration, Rigid Printed Wiring

  • 【Date】2004/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.5.5.7A

  • Characteristic Impedance of Lines on Printed Boards by TDR

  • 【Date】2004/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 2141A CD

  • Design Guide for High-Speed Controlled Impedance Circuit Boards

  • 【Date】2004/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 2141A ERTA

  • Design Guide for High-Speed Controlled Impedance Circuit Boards

  • 【Date】2004/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 2141A

  • Design Guide for High-Speed Controlled Impedance Circuit Boards

  • 【Date】2004/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.6.3.5

  • Bare Board Cleanliness by Surface Insulation Resistance

  • 【Date】2004/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 7912A

  • End-Item DPMO for Printed Circuit Board Assemblies

  • 【Date】2004/1/1
  • 【Language】English
  • 【Status】Active