
IPC
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- 【Organization】IPC
- 【Document #】IPC 0040
Optoelectronics Assembly and Packaging Technology
- 【Date】2003/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 0040 CD
Optoelectronics Assembly and Packaging Technology
- 【Date】2003/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2226 CD
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
- 【Date】2003/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 8413-1
Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
- 【Date】2003/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 8413-1 CD
Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
- 【Date】2003/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-027
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
- 【Date】2003/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-027 CD
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
- 【Date】2003/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 1.3A
Ambient Conditions
- 【Date】2003/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 1.2A
Calibration
- 【Date】2003/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 1.1C
Introduction
- 【Date】2003/1/1
- 【Language】English
- 【Status】Active