IPC
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- 【Organization】IPC
- 【Document #】IPC 4552 GERMAN
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
- 【Date】2002/10/1
- 【Language】German
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4552 GERMAN CD
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
- 【Date】2002/10/1
- 【Language】German
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 9199
Statistical Process Control (SPC) Quality Rating
- 【Date】2002/9/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC CC-830B
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Incorporates Amendment 1: October 2008
- 【Date】2002/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC CC-830B CHINESE
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Incorporates Amendment 1: October 2008
- 【Date】2002/8/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC CC-830B CHINESE CD
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Incorporates Amendment 1: October 2008
- 【Date】2002/8/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TR-583
An In-Depth Look At Ionic Cleanliness Testing
- 【Date】2002/7/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TR-583 CD
An In-Depth Look At Ionic Cleanliness Testing
- 【Date】2002/7/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2252
Design Guide for RF/Microwave Circuit Boards
- 【Date】2002/7/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2252 CD
Design Guide for RF/Microwave Circuit Boards
- 【Date】2002/7/1
- 【Language】English
- 【Status】Active