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TSV Stacked Memory Patent Landscape Analysis
2016/09/01
An emerging market with leading industrials and first patent litigations; Who owns what? more Toyota Prius 4 PCU Power Modules
2016/09/01
Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing.. more Sapphire Applications & Market 2016: LED and Consumer Electronics
2016/09/01
As the prospect of adoption in smartphone display covers dwindles, what is the future for the sapphire industry? more Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
2016/09/01
GaN power devices: a promising, fast-growing market more Point-of-Need Testing: Application of Microfluidic Technologies 2016 report
2016/09/01
Decentralized testing for both human and non-human in-vitro diagnostics is increasingly taking advantage of innovative microfluidic technologies more Murata SAW Thermo-Compensated Band 8 Filter in Low Band Front-End Module
2016/09/01
Murata has introduced thermo-compensated filter technology with a ceramic substrate in the Samsung Galaxy S7’s front-end module more Microbattery Patent Landscape Analysis
2016/09/01
A starting market attracting many players from various industries ; Who owns the key patent? more Infineon CooliR2Die? Power Module
2016/09/01
Infineon power module integrating an IGBT and diode into innovative packaging for electric vehicles. The innovative packaging shrinks the power module.. more Delphi Rear & Side Detection System
2016/09/01
76GHz short-range radar specially designed for blind-spot detection more 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update
2016/09/01
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications. more