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Advanced Substrates Overview: From IC Package to Board
2017/02/01
How can advanced substrates and boards bridge the gap created by front-end scaling? more 2016 Comparison of Application Processor Packaging
2017/01/01
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos.. more Autoliv 77GHz Multi Mode Radar
2017/01/01
A compact, cost-effective and high-performance driving assistance system combining medium- and long-range detection more Fingerprint Sensor Applications and Technologies – Consumer Market Focus
2017/01/01
he rapid-changing fingerprint technology market has expanded impressively into the consumer space – now shipment volumes will benefit from an 18% CAGR.. more Microfluidic Technologies for Diagnostic Applications Patent Landscape
2017/01/01
New comers and emerging applications for oncology and infectious diseases are driving the growth of microfluidics IP more Lenovo Phab2Pro 3D Time of Flight (ToF) Camera Google Tango Ready
2017/01/01
World’s first 3D tri-camera bundle including Infineon/pmd REAL3 ToF image sensor integrated into a consumer smartphone more Enphase S280 Microinverter
2017/01/01
Best in class SmartGrid-ready 280VA inverter with new generation ASIC-based topology for lighter design and enhanced solar power management more Safran Colibrys VS1000 Series
2017/01/01
Single-axis high performance accelerometer with new ASIC design more Solid-State Medical Imaging 2017
2017/01/01
Advanced solid-state technologies are disrupting the medical imaging industry more STMicroelectronics 1200V SiC MOSFET STC30N120
2017/01/01
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost more