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Publisher:
Yole Developpement
(Search Result: About 115 results.)
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3D Cell Culture Technologies Patent Landscape

2016/09/01
IP landscape for 3D cell culture technologies offers an important space to big entities as well as for small companies more

3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update

2016/09/01
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications. more

TSV Stacked Memory Patent Landscape Analysis

2016/09/01
An emerging market with leading industrials and first patent litigations; Who owns what? more

Toyota Prius 4 PCU Power Modules

2016/09/01
Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing.. more

Sapphire Applications & Market 2016: LED and Consumer Electronics

2016/09/01
As the prospect of adoption in smartphone display covers dwindles, what is the future for the sapphire industry? more

Qualcomm Snapdragon Sense ID 3D Qualcomm's New Ultrasonic Fingerprint Sensor

2016/08/01
Qualcomm has introduced the Snapdragon Sense ID, the latest in cutting-edge biometric fingerprint authentication, in the LeMax Pro smartphone from LeE.. more

Wolfspeed C3M? Platform SiC 900V MOSFET

2016/08/01
Wolfspeed (a Cree Company) has proposed the first 900V SiC MOSFET device. The device is a planar MOSFET with lower Rdson, smaller size, and higher cur.. more

Uncooled Infrared Imaging Technology and Market Trends 2016

2016/08/01
In a dynamic IR imaging market with ever more competitors, technologies and products, uncooled IR imager shipments are expected to grow at 15.8% CAGR .. more

Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Microbolometer

2016/08/01
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17μm pixels from the South Korean I3system. more

Fan-Out: Technologies & Market Trends 2016

2016/08/01
Fan-Out packaging: the most dynamic advanced packaging platform. Will it be sustainable long-term? more