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Fan-Out Wafer Level Packaging Patent Landscape Analysis
Publisher: Yole Developpement
Published: 2016/11/01
Price:
EUR 5,990 (Global-User License)
With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position.
