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TSMC Integrated Fan-Out (inFO) Package in Apple’s A10 Application Processor
Publisher: Yole Developpement
Published: 2016/10/01
Price:
EUR 3,490 (Global-User License)
Reverse engineering and costing of the new inFO packaging technology from TSMC used for Apple’s latest A10 application processor, found in the iPhone 7 and 7 Plus
