RF Component Industry Review: July - September 2014

Global shipments of cellphones increased 8 percent in Q3 ’14, while sales and profits of RF and wireless component suppliers increased to close to record levels by historical standards. Notable developments included Qualcomm’s new baseband-apps processor and chipset for entry-tier LTE phones, and the rapid growth of LTE phone shipments in China.

1 Executive Summary
2 Summary and Analysis of Significant Developments
2.1 Financial Highlights
2.2 Product, Market, Technology Highlights
2.3 Mergers, Acquisitions, Divestitures
2.4 RF Startup Funding & IPOs
3 Company Results
3.1 Financial
3.1.1 WiSpry Raises $8 Million
3.1.2 Nordic Q2 FY `14
3.1.3 Intel Q2 FY `14
3.1.4 TSMC Q2 FY `14
3.1.5 Cypress Q2 FY `14
3.1.6 Skyworks Q3 FY `14
3.1.7 TI Q2 FY `14
3.1.8 Broadcom Q2 FY `14
3.1.9 NXP Q2 FY `14
3.1.10 Qualcomm Q3 FY 2014
3.1.11 TriQuint Q2 FY `14
3.1.12 CSR Q2 FY `14
3.1.13 Freescale Q2 FY `14
3.1.14 Maxim Q4 and FY `14
3.1.15 Microsemi Q3 FY `14
3.1.16 RFMD Q1 FY `15
3.1.17 Sequans Q2 FY `14
3.1.18 Silicon Labs Q2 FY `14
3.1.19 Cavium Q2 FY `14
3.1.20 Infineon Q3 FY `14
3.1.21 Melexis Q2 FY `14
3.1.22 CEVA Q2 FY `14
3.1.23 DSP Group Q2 FY `14
3.1.24 Entropic Q2 FY `14
3.1.25 Fujitsu Q1 FY 2014
3.1.26 MediaTek Q2 FY `14
3.1.27 Murata Q1 FY 2015
3.1.28 SEI Q1 FY `14
3.1.29 Sony Q1 FY `15
3.1.30 TDK Q1 FY `15
3.1.31 UMC Q2 FY `14
3.1.32 Seiko-Epson Q1 FY `15
3.1.33 TowerJazz Q2 FY '14
3.1.34 Atmel Q2 FY `14
3.1.35 Renesas Q1 FY 2015
3.1.36 ANADIGICS Q2 FY `14
3.1.37 InterDigital Q2 FY `14
3.1.38 Nvidia Q2 FY `15
3.1.39 Taiyo Yuden Q1 FY `15
3.1.40 NDK Q1 FY '15
3.1.41 Cree Q4 and FY `14
3.1.42 Marvell Q2 FY `15
3.1.43 Analog Devices Q3 FY `14
3.1.44 Avago Q3 FY '14
3.1.45 u-blox H1 FY `14
3.1.46 SiTime Raises $25 Million
3.2 Contracts
3.2.1 RFaxis Partners with CSR for IoT
3.2.2 GreenPeak Chooses RFaxis for Smart Home and IoT
3.2.3 Samsung Chooses Infineon RF
3.2.4 Arvento Selects u-blox
3.2.5 RFaxis Ramps CMOS PAs for Sub-GHz
3.2.6 Several OEMs Using Nordic Bluetooth Smart
3.2.7 Quantenna in ASUS AC2400 Router
3.2.8 ANADIGICS Shipping GaN Amplifier for DOCSIS 3.1
3.2.9 Cavium Small Cell Solution to Use Quortus Software
3.2.10 Microchip Chooses CSR for Bluetooth Smart Module
3.2.11 Telefonica Vivo Chooses Quantenna
3.2.12 NETGEAR Chooses Skyworks for Wi-Fi Router
3.2.13 Samsung Selects Marvell
3.2.14 Maestro Wireless Solutions Using CSR
3.2.15 Broadcom Wi-Fi in Home Thermostat
3.2.16 ZTE 5-Mode Smartphone for CMCC Uses Marvell
3.2.17 Lenovo Using CSR Bluetooth Smart for TV Remote Control
3.2.18 NETGEAR Using Quantenna Wi-Fi
3.2.19 MediaTek in ALCATEL Sand Lenovo Smartphones
3.2.20 ANADIGICS Shipping Wi-Fi PAs for Infrastructure
3.2.21 Altair in D-Link LTE Dongles
3.2.22 Cavendish Kinetics Using TowerJazz SoI
3.2.23 Quantenna 802.11ac Qualifies With MediaTek
3.2.24 Global Invacom Chooses TowerJazz Satellite TV Chipset
3.2.25 Android One with MediaTek
3.2.26 ANADIGICS Wi-Fi in LG Smartphone
3.2.27 Nextivity Chooses ANADIGICS Small-Cell PAs
3.2.28 Ruckus Wireless Chooses TriQuint's Wi-Fi PA Modules
3.2.29 Compal Selects Celeno Wi-Fi for DOCSIS Gateways
3.3 Joint Ventures
3.3.1 New Fujitsu-Panasonic Fabless LSI Company
3.3.2 UMC Joins Fujitsu's New Foundry Company
3.4 Employment
3.4.1 Nujira Appoints VP Sales
3.4.2 Microsemi Mazzo Resigns
3.5 New Products
3.5.1 Aviacomm RF Transceivers
3.5.2 FinScale's Quantum FinFET Process
3.5.3 Decawave UWB Chip for Indoor Location
3.5.4 MediaTek LTE SoC
3.5.5 Quantance ET Tested with Leading PAs
3.5.6 Samsung Chipset for LTE-A
3.5.7 Small Cell SoCs from Broadcom
3.5.8 IMG Processor IP for IoT & Wearables
3.5.9 Nitero 60 GHz for Mobile Devices
3.5.10 RFaxis RF Front-Ends for 802.11ac
3.5.11 Intel Microarchitecture & 14 nm Process
3.5.12 Samsung LTE Baseband
3.5.13 Spreadtrum LTE Modem
3.5.14 CSEM Bluetooth Smart Transceiver IP for IOT
3.5.15 Silicon Labs Global Receiver IC for Car Radio
3.5.16 Maxscend Partners with CEVA for Wi-Fi and Bluetooth IP
3.5.17 Peregrine Carrier-Grade Wi-Fi RF Switch
3.5.18 RFaxis Bare Die Solutions
3.5.19 Freescale Wireless Charging ICs
3.5.20 u-blox Wi-Fi / Bluetooth IoT Module
3.5.21 Broadcom 802.11n/ac 2 x 2 for Mobile Devices
3.5.22 EPCOS Wi-Fi-Bluetooth Filter for Smartphones
3.5.23 TI Bluetooth Smart Wireless Microcontroller
3.5.24 New Qualcomm LTE Processor, Transceivers and Front-End Products
3.5.25 GCT Semiconductor VoLTE
3.5.26 TDK-EPCOS GPS Front-End Modules For Smartphones
3.5.27 TI Solutions for ZigBee Remote Control
3.5.28 GreenPeak Radio IC for Smart Home & IoE
3.5.29 Celeno 802.11ac
3.5.30 Peregrine 18 GHz RF Switches
3.5.31 Peraso 60 GHz Chip
3.5.32 ANADIGICS GaN Line Amplifiers
3.5.33 TSMC Ultra-Low Power Processes for IoT and Wearables
3.5.34 Broadcom GNSS & Sensor Hub Combo Chip
3.5.35 MediaTek SoC for Wi-Fi Infrastructure
3.5.36 Toshiba SP12T
3.5.37 Intel Invests in Tsinghua
3.6 Other
3.6.1 ADC Record
3.6.2 28 nm Supplies Tight
3.6.3 FinScale Quantum FinFET Process
3.6.4 Open Interconnect Consortium
3.6.5 Atmel to Acquire Newport Media
3.6.6 CEVA Acquires RivieraWaves
3.6.7 Google Acquires Alpental
3.6.8 Qualcomm VoLTE Launch
3.6.9 Verizon 3.5 GHz Spectrum Sharing Trials
3.6.10 Broadcom to Close Cellular Business Unit
3.6.11 Samsung Acquires SmartThings
3.6.12 Sprint MIMO
3.6.13 Soitec Wafers for 4 B Devices Shipped
3.6.14 Tsinghua Unigroup Completes Acquisition of RDA Microelectronics
3.6.15 FCC Sets AWS-3 Auction
3.6.16 Qualcomm Strategic Venture Fund in China
3.6.17 VoLTE Launched in the US
3.6.18 Analog Devices Completes Acquisition of Hittite
3.6.19 Atmel Completes Newport Media Acquisition
3.6.20 u-blox Acquires Antcor
3.6.21 Murata to Acquire Peregrine Semiconductor
3.6.22 TowerJazz Qualifies New Fab for RF SoI
3.6.23 TriQuint Shareholders Approve Merger with RF Micro Devices
3.6.24 Verizon Testing LTE in Unlicensed Frequencies
3.6.25 Intel Purchases Powerwave Patent Portfolio
3.6.26 Microsemi to Acquire Centellax
3.6.27 CEA Develops Logo for Ultra HD TV
3.6.28 Intel LTE Chipset Certified by China Mobile
3.6.29 GLOBALFOUNDRIES to Take Over IBM Microelectronics
3.6.30 Ericsson to Exit Cellular Chipsets
3.6.31 More Operators to Launch LTE-A
3.6.32 Huawei Acquires Neul
3.6.33 Nokia Networks & China Telecom Demonstrate FDD-TDD Carrier Aggregation
3.6.34 Intel to Upgrade Fab to 10 nm
3.6.35 AT&T Approves u-blox 3G Module
3.6.36 New Wi-Fi Band in US
3.6.37 TSMC Validates 64-bit ARM Cores Fabricated with FinFETs
4 Companies Tracked for This Report