IPC
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- 【Organization】IPC
- 【Document #】IPC IPC/JEDEC J-STD-033C GERMAN CD
Solderability Tests for Printed Boards - On CD-ROM
- 【Date】2012/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 6018B CD
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
- 【Date】2011/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 6018B CHINESE
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
- 【Date】2011/11/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-004B AMD 1
Requirements for Soldering Fluxes
- 【Date】2011/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2223C GERMAN
Sectional Design Standard for Flexible Printed Boards
- 【Date】2011/11/1
- 【Language】English; German
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2223C CHINESE
Sectional Design Standard for Flexible Printed Boards
- 【Date】2011/11/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2223C CHINESE CD
Sectional Design Standard for Flexible Printed Boards - On CD-ROM
- 【Date】2011/11/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2223C GERMAN CD
Sectional Design Standard for Flexible Printed Boards - On CD-ROM
- 【Date】2011/11/1
- 【Language】German
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 9850A
Surface Mount Placement Equipment Characterization
- 【Date】2011/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4204A CHINESE
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
- 【Date】2011/10/1
- 【Language】Chinese
- 【Status】Active