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Organization / Document #
IPC
Search Result: About 1073 results.

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  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.5.34

  • Power Density Rating for Embedded Resistors

  • 【Date】2012/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.5.5.12A

  • Test Methods to Determine the Amount of Signal Loss on Printed Boards

  • 【Date】2012/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.6.25A

  • Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis

  • 【Date】2012/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 1758

  • Declaration Requirements for Shipping, Pack and Packing Materials

  • 【Date】2012/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.1.13B

  • Inspection for Voids in Flexible Printed Board Materials

  • 【Date】2012/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 9151D

  • Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database

  • 【Date】2012/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 7527

  • Requirements for Solder Paste Printing

  • 【Date】2012/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 7527 CHINESE

  • Requirements for Solder Paste Printing

  • 【Date】2012/5/1
  • 【Language】Chinese
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 7527 DANISH

  • Requirements for Solder Paste Printing

  • 【Date】2012/5/1
  • 【Language】Danish
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 7527 GERMAN

  • Requirements for Solder Paste Printing

  • 【Date】2012/5/1
  • 【Language】Danish
  • 【Status】Active