IPC
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- 【Organization】IPC
- 【Document #】IPC 4412B CHINESE CD
Specification for Finished Fabric Woven from "E" Glass for Printed Boards - On CD-ROM
- 【Date】2013/5/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4412B CD
Specification for Finished Fabric Woven from "E" Glass for Printed Boards - On CD-ROM
- 【Date】2013/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4203A CD
Cover and Bonding Material for Flexible Printed Circuitry - On CD-ROM
- 【Date】2013/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 7095C CHINESE
Design and Assembly Process Implementation for BGAs
- 【Date】2013/1/1
- 【Language】Chinese
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 7095C CD
Design and Assembly Process Implementation for BGAs - On CD-ROM
- 【Date】2013/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.17.1B
Propagation Tear Strength, Flexible Insulating Material
- 【Date】2013/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4556
Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
- 【Date】2013/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4556 CD
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards - On CD-ROM
- 【Date】2013/1/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4552 CD
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards - Incorporates Amendments 1 & 2; On CD-ROM
- 【Date】2012/12/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3.25D
Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract (ROSE)
- 【Date】2012/11/1
- 【Language】English
- 【Status】Active