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Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC J-STD-001FS SPANISH

  • Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

  • 【Date】2014/1/1
  • 【Language】Spanish
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 4103A CD

  • Specification for Base Materials for High Speed/High Frequency Applications - Incorporates Amendment 1

  • 【Date】2014/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/JEDEC-9706

  • Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection

  • 【Date】2013/12/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 1753

  • Materials Declaration Standard for Aerospace and Defense - Incorporates Amendment A1: April 2018; Includes Access to Additional Content

  • 【Date】2013/11/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 9709

  • Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

  • 【Date】2013/11/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC A-630 CD

  • Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC A-630 CHINESE

  • Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures

  • 【Date】2013/9/1
  • 【Language】Chinese
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC A-630

  • Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 2581B CD

  • Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology - On CD-ROM

  • 【Date】2013/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/JEDEC J-STD-033C CHINESE

  • SOLDERABILITY TESTS FOR PRINTED BOARDS

  • 【Date】2013/9/1
  • 【Language】Chinese
  • 【Status】Active