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Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC HDBK-830A

  • Guidelines for Design, Selection and Application of Conformal Coatings

  • 【Date】2013/8/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC HDBK-830A CD

  • Guidelines for Design, Selection and Application of Conformal Coatings

  • 【Date】2013/8/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.52

  • Fracture Toughness of Resin Systmes for Base Materials

  • 【Date】2013/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC J-STD-006C

  • Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

  • 【Date】2013/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC J-STD-006C CD

  • Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

  • 【Date】2013/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC J-STD-006C CHINESE

  • Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

  • 【Date】2013/7/1
  • 【Language】Chinese
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC JPCA-2291

  • Design Guideline for Printed Electronics

  • 【Date】2013/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC JPCA-2291 CD

  • Design Guideline for Printed Electronics

  • 【Date】2013/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 9641

  • High Temperature Printed Board Flatness Guideline

  • 【Date】2013/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 9641 CD

  • High Temperature Printed Board Flatness Guideline - CD Rom

  • 【Date】2013/6/1
  • 【Language】English
  • 【Status】Active