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- 【Organization】IPC
- 【Document #】IPC HDBK-630 CD
Guidelines for Design,Manufacture, Inspection and Testing of Electronic Enclosures - On CD-ROM
- 【Date】2014/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-001F TURKISH
Requirements for Soldered Electrical and Electronic Assemblies - Includes Annex 1: September 2015
- 【Date】2014/6/1
- 【Language】Turkish
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.26A
DC Current Induced Thermal Cycling Test
- 【Date】2014/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.9E
Peel Strength, Flexible Dielectric Materials
- 【Date】2014/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-003C
Solderability Tests for Printed Boards - Incorporates Amendment A1: May 2014; Amendment A2: September 2017
- 【Date】2014/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4101D CD
Specification for Base Materials for Rigid and Multilayer Printed Boards - On CD-ROM
- 【Date】2014/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4412B AMD 1
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
- 【Date】2014/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 1755
Conflict Minerals Data Exchange Standard - Incorporates Amendment 1: March 2015; Amendment 2: March 2017
- 【Date】2014/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.16B
Initiation Tear Strength, Flexible Insulating Materials
- 【Date】2014/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC J-STD-030A
JOINT INDUSTRY STANDARD Selection and Application of Board Level Underfill Materials
- 【Date】2014/2/1
- 【Language】English
- 【Status】Active