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Organization / Document #
IPC
Search Result: About 1073 results.

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  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B VIETNAMESE

  • Requirements and Acceptance for Cable and Wire Harness Assemblies

  • 【Date】2012/10/1
  • 【Language】Vietnamese
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B KOREAN

  • Requirements and Acceptance for Cable and Wire Harness Assemblies - Amendment 1: 08/2013

  • 【Date】2012/10/1
  • 【Language】Korean
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B HUNGARIAN

  • Requirements and Acceptance for Cable and Wire Harness Assemblies - Hungarian

  • 【Date】2012/10/1
  • 【Language】Hungarian
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B POLISH

  • Requirements and Acceptance for Cable and Wire Harness Assemblies - Incorporates Amd 1: 06/2013

  • 【Date】2012/10/1
  • 【Language】Polish
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B HEBREW

  • Requirements and Acceptance for Cable and Wire Harness Assemblies - Incorporates Amd 1: 06/2013

  • 【Date】2012/10/1
  • 【Language】Hebrew
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B TURKISH

  • Requirements and Acceptance for Cable and Wire Harness Assemblies - Incorporates Amd 1: 06/2013

  • 【Date】2012/10/1
  • 【Language】Turkish
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA A-620B CD

  • Requirements and Acceptance for Cable and Wire Harness Assemblies - On CD-ROM

  • 【Date】2012/10/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B ESTONIAN

  • Requirements and Acceptance for Cable and Wire Harness Assemblies (Estonian) - Incorporates Amd 1: 06/2013

  • 【Date】2012/10/1
  • 【Language】Estonian
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/WHMA-A-620B DANISH CD

  • Requirements and Acceptance for Cable and Wire Harness Assemblies; includes Amendment 1: 08/2013

  • 【Date】2012/10/1
  • 【Language】Danish
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC HDBK-850

  • Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly

  • 【Date】2012/7/1
  • 【Language】English
  • 【Status】Active