Hinton Information Services

Need Some Help?
We can help you find the information that meets your research needs.
Please call us at
+886 2 27993110
or send an email to us at standards@hintoninfo.com

Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC SMC-WP-001

  • Soldering Capability

  • 【Date】1991/8/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-310C

  • Guidelines for Phototool Generation and Measurement Techniques

  • 【Date】1991/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-310C CD

  • Guidelines for Phototool Generation and Measurement Techniques

  • 【Date】1991/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.38A

  • Prepreg Scaled Flow Testing

  • 【Date】1991/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.12A

  • Solderability, Edge Dip Method

  • 【Date】1991/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.3.2C

  • Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics

  • 【Date】1991/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.3.1C

  • Flexural Fatigue and Ductility, Flexible Printed Wiring

  • 【Date】1991/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.2.1D

  • Flexural Fatigue and Ductility, Foil

  • 【Date】1991/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TR-485

  • Results of Copper Foil Rupture Strength Test Round Robin Study

  • 【Date】1991/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC SM-784

  • Guidelines for Chip-on- Board Technology Implementation

  • 【Date】1990/11/1
  • 【Language】English
  • 【Status】Active