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Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC SM-784 CD

  • Guidelines for Chip-on- Board Technology Implementation

  • 【Date】1990/11/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC MB-380

  • Guidelines for Molded Interconnection Devices

  • 【Date】1990/10/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC A-142

  • Specification for Finished Fabric Woven from Aramid for Printed Boards

  • 【Date】1990/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC A-142 CD

  • Specification for Finished Fabric Woven from Aramid for Printed Boards

  • 【Date】1990/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC DW-425A

  • Design and End Product Requirements for Discrete Wiring Boards

  • 【Date】1990/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC DW-425A CD

  • Design and End Product Requirements for Discrete Wiring Boards

  • 【Date】1990/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.8.4

  • Carrier Release, Thin Copper

  • 【Date】1990/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC C-406

  • Design and Application Guidelines for Surface Mount Connectors

  • 【Date】1990/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC C-406 CD

  • Design and Application Guidelines for Surface Mount Connectors

  • 【Date】1990/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-859

  • Design Standard for Thick Film Multilayer Hybrid Circuits

  • 【Date】1989/12/1
  • 【Language】English
  • 【Status】Active