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Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC SMC-TR-001 CD

  • Introduction to Tape Automated Bonding & Fine Pitch Technology

  • 【Date】1989/1/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TR-579

  • Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards

  • 【Date】1988/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TR-579 CD

  • Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards

  • 【Date】1988/9/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC SM-780

  • Component Packaging and Interconnecting with Emphasis on Surface Mounting

  • 【Date】1988/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC SM-780 CD

  • Component Packaging and Interconnecting with Emphasis on Surface Mounting

  • 【Date】1988/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.6.3.2B

  • Insulation and Moisture Resistance, Flexible Base Dielectric

  • 【Date】1988/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.42.1

  • High Temperature Mechanical Strength Retention of Adhesives

  • 【Date】1988/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-390A

  • Automated Design Guidelines

  • 【Date】1988/2/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC D-390A CD

  • Automated Design Guidelines

  • 【Date】1988/2/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.42

  • Torsional Strength of Chip Adhesives

  • 【Date】1988/2/1
  • 【Language】English
  • 【Status】Active