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Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC D-859 CD

  • Design Standard for Thick Film Multilayer Hybrid Circuits

  • 【Date】1989/12/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC PD-335 HDBK

  • Electronic Packaging Handbook

  • 【Date】1989/12/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC SM-817 CD

  • General Requirements for Dielectric Surface Mounting Adhesives

  • 【Date】1989/11/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TF-870

  • Qualification and Performance of Polymer Thick Film Printed Boards

  • 【Date】1989/11/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TF-870 CD

  • Qualification and Performance of Polymer Thick Film Printed Boards

  • 【Date】1989/11/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TR-580

  • Cleaning and Cleanliness Test Program Phase 1 Test Results

  • 【Date】1989/10/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.18.2

  • Hot Rupture Strength, Foil

  • 【Date】1989/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.2.12.3

  • Weight and Thickness Determination of Copper Foils with Etchable Carriers

  • 【Date】1989/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.2.12.2

  • Weight and Thickness of Copper Foils with Releasable Carriers

  • 【Date】1989/7/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC SMC-TR-001

  • Introduction to Tape Automated Bonding & Fine Pitch Technology

  • 【Date】1989/1/1
  • 【Language】English
  • 【Status】Active