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Organization / Document #
IPC
Search Result: About 1073 results.

Breadcrumb

  • 【Organization】IPC
  • 【Document #】IPC IPC/EIA J-STD-026

  • Semiconductor Design Standard for Flip Chip Applications

  • 【Date】1999/8/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/EIA J-STD-026 CD

  • Semiconductor Design Standard for Flip Chip Applications

  • 【Date】1999/8/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC TM-650 2.4.22C

  • Bow and Twist (Percentage)

  • 【Date】1999/6/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/JPCA-4104

  • Specification for High Density Interconnect (HDI) and Microvia Materials

  • 【Date】1999/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/JPCA-4104 CD

  • Specification for High Density Interconnect (HDI) and Microvia Materials

  • 【Date】1999/5/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/JEDEC J-STD-035

  • Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

  • 【Date】1999/4/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/JEDEC J-STD-035 CD

  • Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components - Incorporates Amendment 1: January 2007

  • 【Date】1999/4/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 9502

  • PWB Assembly Soldering Process Guideline for Electronic Components

  • 【Date】1999/4/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC 2531

  • SMEMA Standard Recipe File Format Specification

  • 【Date】1999/3/1
  • 【Language】English
  • 【Status】Active
  • 【Organization】IPC
  • 【Document #】IPC IPC/JPCA-6202

  • Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards

  • 【Date】1999/2/1
  • 【Language】English
  • 【Status】Active