IPC
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- 【Organization】IPC
- 【Document #】IPC IPC/JPCA-6202 CD
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
- 【Date】1999/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC QE-605A
Printed Board Quality Evaluation Handbook
- 【Date】1999/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC QE-605A CD
Printed Board Quality Evaluation Handbook
- 【Date】1999/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2524
PWB Fabrication Data Quality Rating System
- 【Date】1999/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TP-1115
Selection and Implementation Strategy for a Low-Residue No-Clean Process
- 【Date】1998/12/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.9.2
Bonding Process
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.24.4
Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias - DMA Method
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.24.5
Glass Transition Temperature and Thermal Expansion of Materials Used in High Density Interconnection (HDI) and Microvias - TMA Method
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.10.1
Insulation Resistivity for Adhesive Interconnection Bonds
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.24
Junction Stability Under Environmental Conditions
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active