IPC
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- 【Organization】IPC
- 【Document #】IPC 2225 CD
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
- 【Date】1998/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.13F
Solder Float Resistance Flexible Printed Wiring Materials
- 【Date】1998/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.19C
Tensile Strength and Elongation, Flexible Printed Wiring Materials
- 【Date】1998/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3.37B
Volatile Content of Adhesive Coated Dielectric Films
- 【Date】1998/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.17E
Volume Resistivity and Surface Resistance of Printed Wiring Materials
- 【Date】1998/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TA-724
Technology Assessment Series on Cleanrooms
- 【Date】1998/4/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.5.5.1
Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHz
- 【Date】1998/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.5.5C
Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band
- 【Date】1998/3/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 6015
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
- 【Date】1998/2/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TP-1114
Laymans´s Guide to Qualifying a Process to J-STD-001B
- 【Date】1998/1/1
- 【Language】English
- 【Status】Active