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- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.33
Measurement of Electrical Overstress from Soldering Hand Tools
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.33.3
Measurement of Electrical Overstress from Soldering Hand Tools - Current Leakage Measurements
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.33.1
Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.33.4
Measurement of Electrical Overstress from Soldering Hand Tools - Shielded Enclosure
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.33.2
Measurement of Electrical Overstress from Soldering Hand Tools - Transient Measurements
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.4.9.1
Peel Strength of Flexible Circuits
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.5.9
Permittivity and Loss Tangent, Parallel Plate, 1 MHz to 1.5 GHz
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.2.21
Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.0
Printed Wiring Board Test Methods
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.5.17.2
Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method
- 【Date】1998/11/1
- 【Language】English
- 【Status】Active