IPC
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- 【Organization】IPC
- 【Document #】IPC 4130
Specification and Characterization Methods for Nonwoven "E" Glass Mat
- 【Date】1998/9/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4130 CD
Specification and Characterization Methods for Nonwoven "E" Glass Mat
- 【Date】1998/9/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.3.10.1
Flammability of Soldermask on Printed Wiring Laminate
- 【Date】1998/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.6.16.1
Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
- 【Date】1998/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4110
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
- 【Date】1998/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 4110 CD
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
- 【Date】1998/8/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 9504
Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
- 【Date】1998/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 9504 CD
Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
- 【Date】1998/6/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC TM-650 2.2.4C
Dimensional Stability, Flexible Dielectric Materials
- 【Date】1998/5/1
- 【Language】English
- 【Status】Active
- 【Organization】IPC
- 【Document #】IPC 2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
- 【Date】1998/5/1
- 【Language】English
- 【Status】Active