IPC
搜尋結果：找到 1073 筆資料
- 【組 織】IPC
- 【文件編號】IPC J-STD-006B CHINESE CD
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Incorporating Amendment 1 and Amendment 2
- 【日 期】2006/1/1
- 【語 言】Chinese
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC 8497-1
Cleaning Methods and Contamination Assessment for Optical Assembly
- 【日 期】2005/12/1
- 【語 言】English
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC 8497-1 CD
Cleaning Methods and Contamination Assessment for Optical Assembly
- 【日 期】2005/12/1
- 【語 言】English
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC WP-008
Setting Up Ion Chromatography Capability
- 【日 期】2005/12/1
- 【語 言】English
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC WP-008 CD
Setting Up Ion Chromatography Capability
- 【日 期】2005/12/1
- 【語 言】English
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC IPC/JEDEC J-STD-033B.1 ITALIAN CD
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
- 【日 期】2005/10/1
- 【語 言】Italian
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC IPC/JEDEC J-STD-033B.1 RUSSIAN
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007
- 【日 期】2005/10/1
- 【語 言】Russian
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC IPC/JEDEC J-STD-033B.1 RUSSIAN CD
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007
- 【日 期】2005/10/1
- 【語 言】Russian
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC IPC/JEDEC J-STD-033B.1 CHINESE
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007
- 【日 期】2005/10/1
- 【語 言】Chinese
- 【狀 態】Active
- 【組 織】IPC
- 【文件編號】IPC IPC/JEDEC J-STD-033B.1 CHINESE CD
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007
- 【日 期】2005/10/1
- 【語 言】Chinese
- 【狀 態】Active
